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Sensesemi Raises ₹25 Crore to accelerate the development of its Edge-AI chip architecture

SmartSolutionUser1 by SmartSolutionUser1
January 24, 2026
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Sensesemi Raises ₹25 Crore to accelerate the development of its Edge-AI chip architecture
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Sensesemi Technologies Private Limited, a DLI-approved fabless semiconductor startup, has raised ₹25 crore (approx. USD 2.75 mn) in a seed funding round led by Piper Serica, with participation from LetsVenture Angel Fund, Sun Icon Ventures, MyAsiaVC, Whitepine Investments, and Jain Oncor. The round also saw backing from angel investors, including REAN Foundation, Niraj Shah, and Deepak Khanna, among others.

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Founded to address the growing demand for high-performance edge processing, Sensesemi is building integrated edge-AI silicon that combines AI inferencing, wireless mesh connectivity, and precision analog signal processing on a single chip. The company’s solutions are designed for industrial IoT, automotive systems, and medical device applications where real-time on-device processing, extended battery life, and secure connectivity are critical.

Unlike conventional edge-AI solutions that rely on multiple components for compute, connectivity, and sensing, Sensesemi is taking a vertically integrated approach and unifying these capabilities on a single silicon platform. The architecture is designed for efficient processing of sensor data, while adhering to the constraints of power consumption and physical area.

Mr. Vijay Muktamath, Founder and CEO of Sensesemi.
Mr. Vijay Muktamath, Founder and CEO of Sensesemi.

“Current edge AI solutions require customers to choose between performance and power efficiency, or between integrated connectivity and security features,” said Mr. Vijay Muktamath, Founder and CEO of Sensesemi. “Our approach is vertical integration of these functions on a single chip to reduce system complexity and power consumption, while providing secure, reliable supply chain access – the primary concerns for customers in these markets.”

Mr. Namit Varma, Co-Founder and Head of Engineering, Sensesemi.
Mr. Namit Varma, Co-Founder and Head of Engineering, Sensesemi.

In parallel, the company is developing an analog AI inference processor to further reduce power consumption in battery-operated and implantable devices. “Applications such as medical implants and industrial sensors operate under severe constraints on power, size, and cost,” said Mr. Namit Varma, Co-Founder and Head of Engineering, Sensesemi. “Analog-domain AI inferencing allows us to achieve dramatic improvements in power efficiency, making multi-year battery life possible without sacrificing intelligence or reliability.”

The company is strategically positioned to capitalize on a rapidly expanding market opportunity, with the global edge-AI chipset market projected to reach an annual volume of 5–7 billion units by 2030, driven by large-scale industrial deployments and growing adoption in medical point-of-care and implantable systems. Sensesemi’s integrated edge-AI chips are designed for a broad range of applications across several high-growth sectors: Industrial IoT spanning predictive maintenance, vision-based quality checks, and environmental monitoring; Automotive with multi-sensor ADAS, driver monitoring and predictive diagnostics; and Medical devices powering cardiac monitoring, neurostimulation and smart drug delivery solutions.

Mr. Abhay Agarwal, Founder & Fund Manager from Piper Serica
Mr. Abhay Agarwal, Founder & Fund Manager from Piper Serica

Commenting on the investment, Mr. Abhay Agarwal, Founder & Fund Manager from Piper Serica said, “India’s semiconductor market is expected to cross USD 100 billion by 2030, and enduring value will be created by companies that own strong chip design IP and system-on-chip capabilities. We are excited to back Sensesemi on its journey as it builds indigenous, ultra-low-power, AI-enabled SoCs for IoT and medical devices, strengthening India’s technology self-reliance while creating globally competitive semiconductor products.”

The seed funding will be used to advance product development, including chip tape-outs and reference design creation, expand Sensesemi’s engineering team, and build strategic partnerships with device manufacturers and ODMs to accelerate commercial adoption of its technology.

If you have an interesting Article / Report/case study to share, please get in touch with us at editors@roymediative.com  roy@roymediative.com, 9811346846/9625243429.

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