Trane Technologies, a global climate innovator, and intelligent power management company Eaton announced a strategic collaboration integrating advanced thermal management and electrical system architectures to help accelerate AI-factory deployment, enhance efficiency and lower costs.
Trane Technologies and Eaton are introducing a first-of-its kind reference design that replaces a traditionally slow, manual and siloed design process with a unified, intelligent system for power and cooling for next-generation data centers. By advancing medium-voltage designs for higher-power density AI factories, the companies can achieve combined energy efficiency gains of up to 15%, cut copper use by as much as 80% and reduce installation costs by up to 30% compared to conventional, low-voltage designs, while enabling faster deployment and reducing complexity. As global data center capacity may almost triple by 2030, with AI driving about 70% of that growth, the reference design provides a more resource-efficient approach to scaling data center infrastructure.
The new reference design is included in both the Trane® Continuum Rubin DSX and Eaton Beam Rubin DSX platforms, built in alignment with the NVIDIA DSX platforms, with Eaton’s technology helping provide power distribution for the Trane platform. By combining the expertise of both companies into coordinated reference designs, data center customers can help accelerate development cycles through pre-coordinated thermal and electrical power systems from grid to chip. The companies’ approach breaks down traditional systems-in-silos architectures, enabling power distribution and cooling systems to exchange leading indicators, respond more dynamically to needs and enhance data center performance.
“AI and high-performance computing are transforming the demands placed on data centers, and customers want solutions that can keep pace with their needs,” said Mr. Mauro J. Atalla, Senior Vice President, Chief Technology and Sustainability Officer, Trane Technologies. “By combining our advanced thermal management solutions with Eaton’s innovative power management solutions, we’re delivering a coordinated design that helps customers accelerate deployment, improve efficiency and confidently plan to scale for the future.”
“We’re advancing the industry standard for speed of deployment by progressing reference designs into unified systems teams can deploy repeatedly. Aligned with the NVIDIA DSX platform, we’re integrating our medium-voltage power systems and white space thermal management solutions with Trane’s advanced thermal management system architecture to help accelerate AI-factory deployment at scale,” said Mr. Michael Regelski, Senior Vice President and Chief Technology Officer, Electrical Sector, Eaton.
The Eaton and Trane Technologies reference design is built to work smoothly with the NVIDIA® Omniverse™ DSX Blueprint for AI data centers. The combined approach establishes a more consistent, predictable method for planning and delivering electrical, thermal and digital control infrastructure required for AI‑driven environments. The coordinated architecture simplifies setup, reduces risk during deployment, and improves overall performance for today’s technologies. It is also designed to evolve as emerging liquid cooling technologies and direct current architectures become mainstream.
“AI factories demand tightly coordinated power, cooling and compute infrastructure to operate efficiently at scale. By aligning with the NVIDIA Omniverse DSX Blueprint, Trane Technologies and Eaton are helping customers reduce complexity and accelerate deployment of next-generation AI data centers,” said Mr. Vladimir Troy, Vice President of AI Infrastructure at NVIDIA. “This new integrated approach supports the robust, scalable foundations enterprises need to unlock the full potential of generative and reasoning AI and turn data into faster, smarter outcomes.”
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